Radio-frequency switching devices having improved voltage handling capability

ABSTRACT

Radio-frequency (RF) switching devices having improved voltage handling capability. In some embodiments, a switching device can include a first terminal and a second terminal, and a plurality of switching elements connected in series to form a stack between the first terminal and the second terminal. The switching elements can have a non-uniform distribution of a parameter that results in the stack having a first voltage handling capacity that is greater than a second voltage handling capacity corresponding to a similar stack having a substantially uniform distribution of the parameter.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims priority to U.S. Provisional Application Nos.61/902,808 filed Nov. 12, 2013, entitled RADIO-FREQUENCY DEVICES HAVINGIMPROVED VOLTAGE HANDLING CAPABILITY, 61/902,809 filed Nov. 12, 2013,entitled RADIO-FREQUENCY DEVICES HAVING IMPROVED ON-RESISTANCEPERFORMANCE, and 61/902,810 filed Nov. 12, 2013, entitledRADIO-FREQUENCY DEVICES HAVING IMPROVED LINEARITY PERFORMANCE, thedisclosure of each of which is hereby expressly incorporated byreference herein in its entirety.

BACKGROUND

1. Field

The present disclosure generally relates to improved radio-frequencyswitching devices.

2. Description of the Related Art

In some radio-frequency (RF) applications, switches are commonlyarranged in a stack configuration to facilitate appropriate handling ofpower. For example, a higher stack height can be utilized to allow an RFswitch to withstand higher power.

SUMMARY

According to some implementations, the present disclosure relates to aswitching device that includes a first terminal and a second terminal.The switching device further includes a plurality of switching elementsconnected in series to form a stack between the first terminal and thesecond terminal. The switching elements have a non-uniform distributionof a parameter. The non-uniform distribution results in the stack havinga first voltage handling capacity that is greater than a second voltagehandling capacity corresponding to a similar stack having asubstantially uniform distribution of the parameter.

In some embodiments, the stack can further have a first ON-resistance(Ron) value that is less than a second Ron value corresponding to thesimilar stack. In some embodiments, the stack can further have a firstlinearity performance that is better than a second linearity performancecorresponding to the similar stack.

In some embodiments, each of the plurality of switching elements caninclude a field-effect transistor (FET) having a source, a drain and agate formed on the active region. The FET can be implemented as asilicon-on-insulator (SOI) device.

In some embodiments, the parameter can include a length of the gate. TheFET can be implemented as a finger configuration device such that thegate includes a number of rectangular shaped gate fingers, with eachgate finger being implemented between a rectangular shaped source fingerof the source contact and a rectangular shaped drain finger of the draincontact.

In some embodiments, the non-uniform distribution of the gate length canbe based on a non-uniform distribution of another parameter associatedwith the FETs. The non-uniform distribution of the gate length cangenerally track the non-uniform distribution of the other parameter.

In some embodiments, the other parameter can include a distribution ofvoltage VDS across each FET. The non-uniform distribution of the gatelength can be selected to yield a scaled version of the voltage VDSdistribution. The scaled version of the voltage VDS distribution can bebased on scaling of the highest value of a voltage VDS distributioncorresponding to a substantially uniform distribution of the gatelength. The highest value of the voltage VDS can be for the first FETfrom the first terminal. The first terminal can be configured as aninput terminal for receiving a radio-frequency (RF) signal.

In some embodiments, the gate length of at least the first FET can begreater than the value of the uniform distribution of the gate length.At least some of the FETs can have gate lengths that are less than thevalue of the uniform distribution of the gate length.

In some embodiments, the sum of the VDS values of the FETs for thenon-uniform distribution of the gate length can be greater than the sumof the VDS values of the FETs for the uniform distribution of the gatelength. The sum of the gate lengths of the FETs for the non-uniformdistribution of the gate length can be greater than the sum of the gatelength of the FETs for the uniform distribution of the gate length.

In some embodiments, the non-uniform distribution of the gate length caninclude a plurality of groups of gate length values, with each grouphaving a common value of the gate length.

In some embodiments, at least some of the FETs can include differentvalues of gate widths. In some embodiments, the first terminal can be aninput terminal and the second terminal can be an output terminal. Insome embodiments, the switching device can be a radio-frequency (RF)switching device.

In a number of implementations, the present disclosure relates to asemiconductor die that includes a semiconductor substrate and aplurality of field-effect transistors (FETs) connected in series to forma stack. The FETs have a non-uniform distribution of a parameter. Thenon-uniform distribution results in the stack having a first voltagehandling capacity that is greater than a second voltage handlingcapacity corresponding to a similar stack having a substantially uniformdistribution of the parameter.

In accordance with a number of teachings, the present disclosure relatesto a method for fabricating a radio-frequency (RF) switching device. Themethod includes providing a semiconductor substrate and forming aplurality of field-effect transistors (FETs) on the semiconductorsubstrate such that the FETs have a non-uniform distribution of aparameter. The method further includes connecting the FETs to form astack, such that the non-uniform distribution results in the stackhaving a first voltage handling capacity that is greater than a secondvoltage handling capacity corresponding to a similar stack having asubstantially uniform distribution of the parameter.

In some implementations, the present disclosure relates to aradio-frequency (RF) switching module that includes a packagingsubstrate configured to receive a plurality of components. The RFswitching module further includes a die mounted on the packagingsubstrate. The die includes a switching circuit. The switching circuitincludes a plurality of field-effect transistors (FETs) connected inseries to form a stack. The FETs have a non-uniform distribution of aparameter. The non-uniform distribution results in the stack having afirst voltage handling capacity that is greater than a second voltagehandling capacity corresponding to a similar stack having asubstantially uniform distribution of the parameter.

According to some implementations, the present disclosure relates to awireless device that includes a transmitter and a power amplifier incommunication with the transmitter. The power amplifier is configured toamplify a radio-frequency (RF) signal generated by the transmitter. Thewireless device further includes an antenna configured to transmit theamplified RF signal. The wireless device further includes a switchingcircuit configured to route the amplified RF signal from the poweramplifier to the antenna. The switching circuit includes a plurality offield-effect transistors (FETs) connected in series to form a stack. TheFETs have a non-uniform distribution of a parameter. The non-uniformdistribution results in the stack having a first voltage handlingcapacity that is greater than a second voltage handling capacitycorresponding to a similar stack having a substantially uniformdistribution of the parameter.

In a number of implementations, the present disclosure relates to aswitching device that includes a first terminal and a second terminal,and a plurality of switching elements connected in series to form astack between the first terminal and the second terminal. The switchingelements has a non-uniform distribution of a parameter. The non-uniformdistribution results in the stack having a first ON-resistance (Ron)value that is less than a second Ron value corresponding to a similarstack having a substantially uniform distribution of the parameter.

In some embodiments, the stack can further have a first voltage handlingcapacity that is at least as high as a second voltage handling capacitycorresponding to the similar stack. In some embodiments, the stack canfurther have a first linearity performance that is better than a secondlinearity performance corresponding to the similar stack.

In some embodiments, each of the plurality of switching elements caninclude a field-effect transistor (FET) having a source, a drain and agate formed on the active region. The FET can be implemented as asilicon-on-insulator (SOI) device.

In some embodiments, the parameter can include a length of the gate. TheFET can be implemented as a finger configuration device such that thegate includes a number of rectangular shaped gate fingers, with eachgate finger being implemented between a rectangular shaped source fingerof the source contact and a rectangular shaped drain finger of the draincontact.

In some embodiments, the non-uniform distribution of the gate length canbe based on a non-uniform distribution of another parameter associatedwith the FETs. The non-uniform distribution of the gate length cangenerally track the non-uniform distribution of the other parameter.

In some embodiments, the other parameter can include a distribution ofvoltage VDS across each FET. The non-uniform distribution of the gatelength can be selected to yield a scaled version of the voltage VDSdistribution. The scaled version of the voltage VDS distribution can bebased on scaling of the highest value of a voltage VDS distributioncorresponding to a substantially uniform distribution of the gatelength. The highest value of the voltage VDS can be for the first FETfrom the first terminal. The first terminal can be configured as aninput terminal for receiving a radio-frequency (RF) signal.

In some embodiments, the gate length of at least the first FET can begreater than the value of the uniform distribution of the gate length.At least some of the FETs can have gate lengths that are less than thevalue of the uniform distribution of the gate length.

In some embodiments, the sum of the VDS values of the FETs for thenon-uniform distribution of the gate length can be greater than the sumof the VDS values of the FETs for the uniform distribution of the gatelength. The sum of the gate lengths of the FETs for the non-uniformdistribution of the gate length can be greater than the sum of the gatelength of the FETs for the uniform distribution of the gate length.

In some embodiments, the non-uniform distribution of the gate length caninclude a plurality of groups of gate length values, with each grouphaving a common value of the gate length.

In some embodiments, at least some of the FETs can include differentvalues of gate widths. In some embodiments, the first terminal can be aninput terminal and the second terminal can be an output terminal. Insome embodiments, the switching device can be a radio-frequency (RF)switching device.

According to some teachings, the present disclosure relates to asemiconductor die that includes a semiconductor substrate and aplurality of field-effect transistors (FETs) connected in series to forma stack. The FETs have a non-uniform distribution of a parameter. Thenon-uniform distribution results in the stack having a firstON-resistance (Ron) value that is less than a second Ron valuecorresponding to a similar stack having a substantially uniformdistribution of the parameter.

In some implementations, the present disclosure relates to a method forfabricating a radio-frequency (RF) switching device. The method includesproviding a semiconductor substrate and forming a plurality offield-effect transistors (FETs) on the semiconductor substrate such thatthe FETs have a non-uniform distribution of a parameter. The methodfurther includes connecting the FETs to form a stack, such that thenon-uniform distribution results in the stack having a firstON-resistance (Ron) value that is greater than a second Roncorresponding to a similar stack having a substantially uniformdistribution of the parameter.

In accordance with a number of implementations, the present disclosurerelates to a radio-frequency (RF) switching module that includes apackaging substrate configured to receive a plurality of components, anda die mounted on the packaging substrate. The die has a switchingcircuit that includes a plurality of field-effect transistors (FETs)connected in series to form a stack. The FETs have a non-uniformdistribution of a parameter. The non-uniform distribution results in thestack having a first ON-resistance (Ron) value that is less than asecond Ron value corresponding to a similar stack having a substantiallyuniform distribution of the parameter.

In some teachings, the present disclosure relates to a wireless devicethat includes a transmitter and a power amplifier in communication withthe transmitter. The power amplifier is configured to amplify aradio-frequency (RF) signal generated by the transmitter. The wirelessdevice further includes an antenna configured to transmit the amplifiedRF signal, and a switching circuit configured to route the amplified RFsignal from the power amplifier to the antenna. The switching circuitincludes a plurality of field-effect transistors (FETs) connected inseries to form a stack. The FETs have a non-uniform distribution of aparameter. The non-uniform distribution results in the stack having afirst ON-resistance (Ron) value that is less than a second Ron valuecorresponding to a similar stack having a substantially uniformdistribution of the parameter.

According to some implementations, the present disclosure relates to aswitching device that includes a first terminal and a second terminal,and a plurality of switching elements connected in series to form astack between the first terminal and the second terminal. The switchingelements have a non-uniform distribution of a parameter. The non-uniformdistribution results in the stack having a first linearity performancethat is better than a second linearity performance corresponding to asimilar stack having a substantially uniform distribution of theparameter.

In some embodiments, the stack can further have a first voltage handlingcapacity that is at least as high as a second voltage handling capacitycorresponding to the similar stack. In some embodiments, the stack canfurther have a first ON-resistance (Ron) value that is less than asecond Ron value corresponding to the similar stack.

In some embodiments, each of the plurality of switching elements caninclude a field-effect transistor (FET) having a source, a drain and agate formed on the active region. The FET can be implemented as asilicon-on-insulator (SOI) device.

In some embodiments, the parameter can include an area of the gate.

In some embodiments, the parameter can include a length of the gate. TheFET can be implemented as a finger configuration device such that thegate includes a number of rectangular shaped gate fingers, with eachgate finger being implemented between a rectangular shaped source fingerof the source contact and a rectangular shaped drain finger of the draincontact.

In some embodiments, the non-uniform distribution of the gate length canbe based on a non-uniform distribution of another parameter associatedwith the FETs. The non-uniform distribution of the gate length cangenerally track the non-uniform distribution of the other parameter.

In some embodiments, the other parameter can include a distribution ofvoltage VDS across each FET. The non-uniform distribution of the gatelength can be selected to yield a scaled version of the voltage VDSdistribution. The scaled version of the voltage VDS distribution can bebased on scaling of the highest value of a voltage VDS distributioncorresponding to a substantially uniform distribution of the gatelength. The highest value of the voltage VDS can be for the first FETfrom the first terminal. The first terminal can be configured as aninput terminal for receiving a radio-frequency (RF) signal.

In some embodiments, the gate length of at least the first FET can begreater than the value of the uniform distribution of the gate length.At least some of the FETs can have gate lengths that are less than thevalue of the uniform distribution of the gate length.

In some embodiments, the sum of the VDS values of the FETs for thenon-uniform distribution of the gate length can be greater than the sumof the VDS values of the FETs for the uniform distribution of the gatelength. The sum of the gate lengths of the FETs for the non-uniformdistribution of the gate length can be greater than the sum of the gatelength of the FETs for the uniform distribution of the gate length.

In some embodiments, the non-uniform distribution of the gate length caninclude a plurality of groups of gate length values, with each grouphaving a common value of the gate length.

In some embodiments, the first linearity performance can include a firstON-resistance (Ron) value that is less than a second Ron valuecorresponding to the second linearity performance. The distribution ofVDS can be a non-uniform distribution to provide voltage handlingcapacity of the FETs as needed while maintaining the first Ron valueless than the second Ron value.

In some embodiments, at least some of the FETs can include differentvalues of gate widths. In some embodiments, the first terminal can be aninput terminal and the second terminal can be an output terminal. Insome embodiments, the switching device can be a radio-frequency (RF)switching device.

According to a number of teachings, the present disclosure relates to asemiconductor die having a semiconductor substrate and a plurality offield-effect transistors (FETs) connected in series to form a stack. TheFETs have a non-uniform distribution of a parameter. The non-uniformdistribution results in the stack having a first linearity performancethat is better than a second linearity performance corresponding to asimilar stack having a substantially uniform distribution of theparameter.

In some teachings, the present disclosure relates to a method forfabricating a radio-frequency (RF) switching device. The method includesproviding a semiconductor substrate and forming a plurality offield-effect transistors (FETs) on the semiconductor substrate such thatthe FETs have a non-uniform distribution of a parameter. The methodfurther includes connecting the FETs to form a stack, such that thenon-uniform distribution results in the stack having a first linearityperformance that is better than a second linearity performancecorresponding to a similar stack having a substantially uniformdistribution of the parameter.

In a number of implementations, the present disclosure relates to aradio-frequency (RF) switching module that includes a packagingsubstrate configured to receive a plurality of components, and a diemounted on the packaging substrate. The die has a switching circuit thatincludes a plurality of field-effect transistors (FETs) connected inseries to form a stack. The FETs have a non-uniform distribution of aparameter. The non-uniform distribution results in the stack having afirst linearity performance that is better than a second linearityperformance corresponding to a similar stack having a substantiallyuniform distribution of the parameter.

According to some implementations, the present disclosure relates to awireless device having a transmitter and a power amplifier incommunication with the transmitter. The power amplifier is configured toamplify a radio-frequency (RF) signal generated by the transmitter. Thewireless device further includes an antenna configured to transmit theamplified RF signal, and a switching circuit configured to route theamplified RF signal from the power amplifier to the antenna. Theswitching circuit includes a plurality of field-effect transistors(FETs) connected in series to form a stack. The FETs have a non-uniformdistribution of a parameter. The non-uniform distribution results in thestack having a first linearity performance that is better than a secondlinearity performance corresponding to a similar stack having asubstantially uniform distribution of the parameter

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

The present disclosure relates to U.S. patent application Ser. No.______ [Attorney Docket 75900-50041 US], titled “DEVICES AND METHODSRELATED TO RADIO-FREQUENCY SWITCHES HAVING IMPROVED ON-RESISTANCEPERFORMANCE,” and U.S. patent application Ser. No. ______ [AttorneyDocket 75900-50042US], titled “IMPROVED LINEARITY PERFORMANCE FORRADIO-FREQUENCY SWITCHES,” each filed on even date herewith and eachhereby incorporated by reference herein in its entirety.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a radio-frequency (RF) switch having a tuned stack.

FIG. 2 shows that in some embodiments, switching transistors such asFETs for the stack of FIG. 1 can be implemented in a fingerconfiguration.

FIG. 3 shows an example side sectional view of a portion indicated inFIG. 2.

FIG. 4 depicts a stack having a plurality of individual FETs.

FIG. 5A shows that in some embodiments, a stack of FETs can beimplemented with the FETs having a non-uniform distribution of a FETparameter, and where a first parameter distribution can generally tracka second parameter distribution.

FIG. 5B shows an example where the first parameter distribution has arelationship with the second parameter distribution, where therelationship is different than the scaled tracking relationship in theexample of FIG. 5A.

FIG. 6 shows that in some embodiments, the first parameter distributioncan include a plurality of groups of values, where FETs in each grouphave a common parameter value.

FIG. 7 shows an example stack having 35 FETs in which varying values of,for example, gate width can be implemented so as to reduce voltagedivision imbalance within the stack.

FIG. 8 shows a circuit representation of the example stack of FIG. 7.

FIG. 9 shows an example distribution of voltage values across the FETsof a stack having a fixed Lg value.

FIG. 10 shows am example where the voltage distribution of FIG. 9 can beadjusted to yield a scaled distribution by implementation of anon-uniform Lg distribution.

FIG. 11 shows a process that can be implemented to configure a stackhaving one or more features as described herein.

FIG. 12 shows a process that can be implemented to fabricate a stackhaving one or more features described herein.

FIG. 13 shows an example of an RF switch having a stack of a pluralityof FETs.

FIG. 14 shows an example RF switch where dimension variation of the FETscan be implemented as, for example, different gate lengths.

FIG. 15 depicts an RF switch configured to switch one or more signalsbetween one or more poles and one or more throws.

FIG. 16 shows that in some embodiments, the RF switch of FIG. 15 caninclude an RF core and an energy management (EM) core.

FIG. 17 shows a more detailed example configuration of the RF core ofFIG. 16, implemented in an example SPDT (single-pole double-throw)configuration.

FIG. 18 shows an example where the SPDT configuration of FIG. 17 isimplemented with a stack of FETs for each of a series arm and a shuntarm associated with each of the two throws.

FIG. 19 shows that FETs having one or more features as described hereincan be controlled by a circuit configured to provide bias and/orcoupling functionality.

FIG. 20 shows examples of how biasing and/or coupling of different partsof one or more FETs can be implemented.

FIGS. 21A and 21B show plan and side sectional views of an examplefinger-based FET device implemented on silicon-on-insulator (SOI).

FIGS. 22A and 22B show plan and side sectional views of an examplemultiple-finger FET device implemented on SOI.

FIGS. 23A-23D show non-limiting examples of how one or more features ofthe present disclosure can be implemented on one or more semiconductordie.

FIGS. 24A and 24B show that one or more die having one or more featuresdescribed herein can be implemented in a packaged module.

FIG. 25 shows a schematic diagram of an example switching configurationthat can be implemented in a module such as the example of FIGS. 24A and24B.

FIG. 26 depicts an example wireless device having one or moreadvantageous features described herein.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

In antenna tuning or some other radio-frequency (RF) switchingapplications, a plurality of switching elements (e.g., field-effecttransistors (FET)) can be used as passive components. They are commonlyarranged in a stack configuration to facilitate appropriate handling ofpower. For example, a higher FET stack height can be utilized to allowan RF switch to withstand high power under mismatch.

In some applications, RF switches can be subjected to high peak RFvoltages that are much higher than the voltage handling capability of asingle FET. For example, RF switches handling GSM power commonly need tobe designed to handle 25 Vpk while using FETs, with an individualhandling voltage of, for example, 1.5V for 0.18 μm onsilicon-on-insulator (SOI) device, and 5 Vpk for a gallium arsenide(GaAs) pseudomorphic high-electron-mobility transistor (pHEMT) device.

FET stacking configurations are commonly utilized (e.g., stack ofindividual FETs, multi-gate devices, or some combination thereof) toincrease the voltage handling capability. In an ideal environment, thetotal voltage handling of a stack of such FETs should be equal to thesum of the individual handling voltages. However, parasitic effects(e.g., capacitive and/or resistive) relative to ground, between FETs ofthe stack, and/or respect to any other node associated with the stackcircuit (such as a bias circuitry) can reduce the effective voltagehandling capability by shunting some energy away from the stack of FETs.

For example, applications with higher voltage handling designs such ason-antenna tuning (e.g., aperture tuning), impedance matching, or higherpower applications associated with base-stations, peak voltages can beas high as, for example, 100V to 200V. These designs typically utilizethe stacking of a much higher number of devices, and the parasiticeffects can become predominant, thereby limiting the maximum achievablevoltage handling capability.

In the context of the foregoing higher voltage applications, more FETscan be arranged in series to meet the voltage handling requirements whenthe FETs are in an OFF state. Such an increase in the number of FETs maynot be ideal in some situations. For example, degradation inON-resistance (Ron) performance can occur when the FETs are in an ONstate. It is noted that the total ON-resistance (Ron_total) of the stackis approximately equal to the stack height (stack_height) times theON-resistance of a single FET (Ron_single_FET), assuming that all FETshave the same value of Ron_single_FET. For the voltage handlingcapability, the total voltage handling capacity (Vhandling) of the stackis typically much less than the product of the stack height(stack_height) and the voltage handling capacity of a single FET(Vhandling_single_FET). Thus, in some situations, Ron can degrade fasterthan the voltage handling improvement.

In the foregoing higher voltage applications where higher numbers ofFETs are utilized, some FETs can be subjected to more voltages acrossthem than necessary; and such devices can be further optimized in termof linearity (e.g., harmonics and intermodulation (e.g., IMD2, IMD3,IMD5, IP2, IP3)).

As described herein, one or more features of the present disclosure canprovide, among others, improvements in the voltage handling capabilityof a given stack. In some embodiments, one or more of such advantageousfeatures can be implemented in a simple stack of FETs, or a stack thatutilizes other techniques for voltage imbalance compensation. In someembodiments, one or more of such advantageous features can also beimplemented to yield or along with linearity improvement, and/or otherbiasing configurations for improving RF characteristics. Examplesassociated with such improvements in voltage handling performance aredescribed herein in greater detail.

Also as described herein, one or more features of the present disclosurecan allow reduction of the total Ron while maintaining the same ordesirable voltage handling capability of the stack. In some embodiments,one or more of such advantageous features can be implemented in a simplestack of FETs, or a stack utilizes other techniques for voltageimbalance compensation. In some embodiments, one or more of suchadvantageous features can also be implemented to yield or along withlinearity improvement, and/or other biasing configurations for improvingRF characteristics. Examples associated with such improvements in Ronperformance are described herein in greater detail.

As also described herein, one or more features of the present disclosurecan allow further improvement in the linearity performance of the OFFstack by, for example, using more linear devices (e.g., typicallyshorter gate length) in parts of the stack where they can safely be usedwhen in the OFF state. In some situations, the use of shorter gatelength to improve linearity of the OFF stack can also improve thelinearity of the ON stack by reducing the stack's overall Ron. Forexample, if the value of Ron increases in an RF system, the voltagedeveloping across the ON stack can increase along with the harmonics andother linearity-degrading effects. A more compact area resulting fromthe use of a shorter gate length can reduce the coupling of the FET withthe substrate and thus reduce non-linearity effects induced by thesubstrate. Further, such a reduction in area can allow use of a smallerdie, thereby providing benefits associated with reduced cost and diesize without sacrificing RF performance. Examples associated with suchselective use of gate lengths to achieve further improvements inlinearity performance are described herein in greater detail.

Described herein are devices and methods that can be implemented toaddress, among others, some or all of the foregoing examples ofchallenges and solutions associated with FET stacks. Although describedin the context of FET stacks, it will be understood that one or morefeatures of the present disclosure can also be implemented in switchingstacks that utilize other types of switching elements. For example,switching or other type of stacks having diodes ormicroelectromechanical systems (MEMS) devices (e.g., MEMS capacitors orMEMS switches) as elements can also benefit from implementation of oneor more features as described herein.

FIG. 1 schematically shows an RF switch 100 having a tuned stack 200. Insome embodiments, such a tuned stack can be implemented by some or allof the FETs in the stack having different values of a parameter selectedto achieve a desired functionality for the stack. Such a desiredfunctionality can include some or all of the three examples describedherein—improved voltage handling capability of a given stack, improvedRon performance, and improved linearity performance.

In some embodiments, the foregoing parameter having different values ina stack can include, for example, a dimension or a physical propertyassociated with a part of a FET. In some embodiments, such a partassociated with the FET can include a part that is inherent to the FETitself. In such embodiments, one can see that advantageous featuresprovided by such tuning based on inherent part(s) of the FETs can bebeneficial, since additional external components are not necessarilyneeded.

For the purpose of description, it will be understood that FETs caninclude, for example, metal-oxide-semiconductor FETs (MOSFETs) such asSOI MOSFETs. It will also be understood that FETs as described hereincan be implemented in a number of process technologies, including butnot limited to HEMT, SOI, silicon-on-sapphire (SOS), and CMOStechnologies.

FIG. 2 shows that in some embodiments, a FET 300 for a stack can beimplemented in a finger configuration. Although various examples aredescribed herein in the context of such a finger configuration, otherFET configurations can also be implemented and benefit from one or morefeatures of the present disclosure.

In the example, the FET 300 is shown to include an active region 302having a dimension of length L and width Wg. Although described in theexample context of a rectangular shape, it will be understood that othershapes of active region are also possible.

A plurality of source (S) and drain (D) contacts are shown to beimplemented in a finger configuration, with gate fingers (304, with gatelength Lg) interleaved therebetween. In some embodiments, each of thesource and drain contacts (S, D) can form an ohmic metal contact withthe active region 302, and each of the gate fingers 304 can include ametal contact coupled with the active region 302 through a gate oxidelayer. Each of the source contacts S can be electrically connected to afirst input node In, and each of the drain contacts D can beelectrically connected to a first output node Out. It will be understoodthat each of S and D can be either an input or output, depending on agiven layout. Each of the gates 304 can be electrically connected to agate node G. Operation of such an FET as a switch element (e.g., byturning it ON or OFF by application of appropriate gate signals) can beimplemented in known manners.

In some embodiments, one or more of the example FET parameters such asthe active region length (e.g., L), gate width (e.g., Wg), gate length(e.g., Lg) can be different among at least some of the FETs in a stack.In the context of the active region length L, variation in such a FETparameter can be implemented by or facilitate, for example, differentnumbers of source-gate-drain units, length dimension (horizontal in theexample depicted in FIG. 2) of the source, drain and/or gate fingers, orany combination thereof.

FIG. 3 shows an example side sectional view of a portion indicated inFIG. 2. The example in FIG. 3 shows an SOI configuration; however, itwill be understood that one or more features of the present disclosurecan also be implemented in other types of switching transistors.

In some embodiment, a source-gate-drain unit can include an insulator322 formed over a substrate 320. A body 324 is shown to be formed overthe insulator 322, and source/drain regions 326, 328 are shown to beformed on the body 324. The source/drain regions 326, 328 are shown tobe separated by a portion of the body 324 below a gate 304 having alength dimension Lg. A gate oxide layer 330, having a thicknessdimension d1, is shown to be provided between the gate 304 and the body324.

In some embodiments, the gate length Lg, the gate oxide layer thicknessd1, profiles of any doped areas in the FET, or any combination thereof,can be adjusted so as to yield a stack having at least somedifference(s) in such parameter(s) among the FETs. The doped areas caninclude, for example, the source/drain regions 326, 328, the body 324, ahalo region (not shown in FIG. 3), or any other doped area.

FIG. 4 schematically depicts a stack 200 having a plurality ofindividual FETs 300. N such FETs are shown to be connected in seriesbetween an input node (IN) and an output node (OUT), with the quantity Nbeing a positive integer greater than 1. It will be understood that theinput and output can be reversed in some embodiments, such that the OUTnode receives a signal and the IN node outputs the signal.

As described herein, some or all of the FETs 300 in the stack 200 canhave one or more parameters that are different from the other FETs.Examples of FETs having such different parameter(s) are described hereinin greater detail.

FIG. 5A shows that in some embodiments, a stack of FETs, such as theexample of FIG. 4, can be implemented with the FETs having a non-uniformdistribution 330 of a FET parameter. Such a non-uniform distribution canbe based on a distribution 332 of another parameter associated with theFETs. In the example of FIG. 5A, the non-uniform distribution 330 isreferred to as a first parameter distribution; and the non-uniformdistribution 332 is referred to as a second parameter distribution.Examples of such FET parameters associated with the first and seconddistributions 330, 332 are described herein in greater detail.

FIG. 5A shows an example where the first parameter distribution 330 cangenerally track the second parameter distribution 332. In someembodiments, however, other types of relationships can be implemented.For example, FIG. 5B shows an example where the first parameterdistribution 330 has a relationship with the second parameterdistribution 332, where the relationship is different than the scaledtracking relationship in the example of FIG. 5A. Such a relationship caninclude, for example, a situation where the first parameter distribution330 increases when the second parameter distribution 332 decreases, andvice versa. Other types of relationships are also possible.

In each of the examples of FIGS. 5A and 5B, the first parameterdistribution 330 that is implemented or is to be implemented in a stack,is depicted as a continuous function based on its respective secondparameter distribution 332. For example, for a given FET number, thefirst parameter distribution 330 can have any value. However, it may notbe desirable or practical to vary the parameter for every FET in such acontinuous or fine manner.

FIG. 6 shows that in some embodiments, the first parameter distributioncan include a plurality of groups of values, where FETs in each grouphave a common parameter value. For example, a group (330 a) of FETs isshown to have a common value for the FET parameter for a correspondingrange of the second parameter distribution. Similarly, a group (330 b)of FETs is shown to have a common value for the FET parameter for acorresponding range of the second parameter distribution. Overall, thetrend of the grouped common values (330 a-330 e) can generally track thesecond parameter distribution 332. It will be understood that othertypes of relationships (such as the example of FIG. 5B) can also beimplemented with the foregoing grouping of FET parameter values.

FIGS. 7-10 show examples of how a FET parameter such as a gate length Lgcan be mapped for a stack of FETs, based on another FET parameter suchas a voltage across a FET (VDS). In such examples, a distribution of Lgvalues can be the first parameter distribution described herein inreference to FIGS. 5 and 6; and a distribution of VDS values can be thesecond parameter distribution. The examples of FIGS. 7-10 alsodemonstrate how performance of the stack can be improved for differentoperating parameters based on such mapping of the first parameter (e.g.,Lg values). In some implementations, such improvement(s) can be achievedwithout sacrificing performance in other operating parameter(s).

FIG. 7 shows a stack 200 having 35 FETs (FET_1, FET_2, . . . , FET_35).It will be understood that other numbers of FETs can be utilized. In theexample, the FETs are shown to have varying values of gate width (Wg inFIG. 2, Wg1, Wg2, etc. in FIG. 7) so as to, for example, reduce voltagedivision imbalance within the stack 200. Additional details concerningsuch a technique can be found in U.S. patent application Ser. No.14/451,321, entitled FIELD-EFFECT TRANSISTOR STACK VOLTAGE COMPENSATION,which is expressly incorporated by reference in its entirety.

For example, a stack having 10 FETs with respective gate widths Wg1 toWg10 are listed in Table 1. Each of the 10 FETs in Table 1 has 100 gatefingers.

TABLE 1 FET # Gate width Gate width value (μm) 1 Wg1 13.6 2 Wg2 11.9 3Wg3 10.8 4 Wg4 10.0 5 Wg5 9.5 6 Wg6 8.9 7 Wg7 8.5 8 Wg8 8.3 9 Wg9 8.2 10 Wg10 8.5For such variable-dimension FETs, it is shown by simulated data thatrelative voltage drop at each of the FETs is much more uniform than aconfiguration of 10 FETs having a constant gate width (e.g., 10 μm).

For example, in the constant gate width configuration, there is avoltage drop of about 0.135 of an input voltage (e.g., 5V) across FET1,about 0.118 of the input voltage across FET2, and so on, with thevoltage drop decreasing to about 0.087 of the input voltage across FET9(and increasing slightly for FET10). For the variable dimensionconfiguration of Table 1, there is a voltage drop of about 0.103 of theinput voltage (e.g., 5V) across FET1, about 0.101 of the input voltageacross each of FET2 to FET10. Thus, one can see that voltage imbalancecan be reduced drastically by the variable dimension configuration ofTable 1 so as to yield a generally even voltage distribution. In someembodiments, such a relatively even voltage distribution along the stackcan result in improvement of switch performance with respect to, forexample, harmonic peaking, compression point and/or intermodulationdistortion (IMD).

It is further noted that in the foregoing even voltage distributionexample, the highest value is approximately 0.103 of the input voltage(across the first FET). Accordingly, a breakdown voltage of the examplestack of Table can be estimated by scaling the input voltage (e.g., 5V)with the weak link having the highest relative voltage drop (e.g., 0.103for the first FET). One can see that such an estimate desirably yields avalue of 5/0.103, or approximately 48V, which is very close to theestimate for an ideal configuration that does not have voltageimbalance.

FIG. 8 shows a circuit representation of the example stack 200 of FIG.7. As shown, 35 FETs (300 a, 300 b, . . . , 300 n) can be connected inseries, with the first FET 300 a being in communication with an inputnode (IN), and the last FET 300 n being in communication with an outputnode (OUT). As described herein the stack 200 can be operated in reversein some implementations, such that the input signal is provided at theOUT terminal and the output signal is provided at the IN terminal.

In the example circuit of FIG. 8, each FET is depicted as having aplurality of gate fingers in communication with a gate signal node Gthrough a gate resistance. Such gate nodes can be controlled togetherfor all of the FETs, individually, or some combination thereof.

In the example circuit, nodes 342 (e.g., 304 in FIG. 3) are the same asthe gate nodes G, and a body node for each FET is indicated as 340.Further, parallel-RC circuits 344 are shown to provide example substratecoupling.

For the example stack configuration of FIGS. 7 and 8, a simulation wasperformed with a fixed value of Lg (e.g., approximately 0.32 μm) for allof the 35 FETs. Voltage values across the respective FETs observed insuch a simulation are listed in Table 2, under the VDS column. The sameVDS values are plotted in FIG. 9 (curve 352), along with the fixed Lgvalue (line 350).

TABLE 2 FET Number VDS (V) Fixed Lg (μm) 1 3.00 0.32 2 2.96 0.32 3 2.920.32 4 2.78 0.32 5 2.76 0.32 6 2.71 0.32 7 2.70 0.32 8 2.77 0.32 9 2.650.32 10 2.63 0.32 11 2.62 0.32 12 2.57 0.32 13 2.51 0.32 14 2.47 0.32 152.40 0.32 16 2.38 0.32 17 2.29 0.32 18 2.19 0.32 19 2.15 0.32 20 2.040.32 21 1.96 0.32 22 1.93 0.32 23 1.85 0.32 24 1.76 0.32 25 1.80 0.32 261.79 0.32 27 1.82 0.32 28 1.85 0.32 29 1.79 0.32 30 1.86 0.32 31 1.930.32 32 2.08 0.32 33 2.12 0.32 34 2.14 0.32 35 2.18 0.32

In some implementations, a larger gate length Lg typically yields ahigher breakdown voltage (BVdss). In some situations, higher values ofBVdss are desirable; however, there is typically a limit on how much Lgcan be increased without significantly degrading other performanceparameter(s) of the FET.

In the example of FIG. 9 and Table 1, the highest VDS value isassociated with the first FET, at approximately 3.00V, which ispreferably below the breakdown voltage BVdss for that FET. Near theother end, the lowest VDS value is approximately 1.76V for FET 24. Thus,a constant gate length value Lg (e.g., 0.32 μm) for all of the FETshaving such a range of VDS values is not an efficient implementation ofa gate dimension such as Lg. For example, a FET may be able have alarger Lg value than the constant value (e.g., 0.32 μm) so as toincrease BVdss without significantly degrading performance. In anotherexample, a FET may be able to have a lower Lg value than the constantvalue (e.g., 0.32 μm) because BVdss may not need to be as high.

In some embodiments, a FET stack such as the examples described hereincan be tuned for a more efficient implementation of a FET parameter suchas gate length Lg. With such a tuned configuration, the stack as a wholecan benefit significantly. Examples associated with such tuning andbenefits that can be realized are described herein in greater detail.

In some implementations, the foregoing tuning technique can includeidentification of a distribution of VDS across a stack. Such adistribution can be obtained by, for example, simulation and/ormeasurement. The VDS curve 352 in FIG. 9 is an example of such adistribution.

Based on some configuration (e.g., type and/or process technology)associated with the FETs of the stack, the highest VDS value (e.g., thefirst FET) of the foregoing VDS-distribution can be scaled up to ahigher value that is still below the breakdown voltage BVdss with anincreased gate length Lg that is still acceptable (e.g., in terms of itseffects on other FET performance parameters). With such a scaled VDSvalue, the VDS-distribution can be scaled up accordingly. For example,the VDS-distribution (e.g., curve 352 in FIG. 9) can be scaled up byapproximately 12%.

FIG. 10 shows the same un-scaled VDS curve 352 of FIG. 9, as well as ascaled VDS curve 356 that is approximately 1.12 times the curve 352.Values associated with the un-scaled VDS curve 352 and the scaled VDScurve 356 are listed in Table 3 under columns indicated as “VDS” and“Scaled VDS.” In some embodiments, and as shown by example in FIG. 10and Table 3, the scaled VDS values for a given Lg value can remain at orbelow a maximum or selected VDS value.

For example, FETs 1-8 having Lg of 0.36 μm are shown to have scaled VDSvalues that are less than or equal to a corresponding selected VDS valueof 3.5V. Similarly, FETs 9-13 having Lg of 0.32 μm are shown to havescaled VDS values that are less than or equal to a correspondingselected VDS value of 3.0V; FETs 14-23 having Lg of 0.28 μm are shown tohave scaled VDS values that are less than or equal to a correspondingselected VDS value of 2.8V; FETs 24-29 having Lg of 0.24 μm are shown tohave scaled VDS values that are less than or equal to a correspondingselected VDS value of 2.0V; and FETs 30-35 having Lg of 0.28 μm areshown to have scaled VDS values that are less than or equal to acorresponding selected VDS value of 2.8V.

TABLE 3 FET Number VDS (V) Scaled VDS (V) Scaled Lg (μm) 1 3.00 3.360.36 2 2.96 3.32 0.36 3 2.92 3.27 0.36 4 2.78 3.11 0.36 5 2.76 3.09 0.366 2.71 3.04 0.36 7 2.70 3.02 0.36 8 2.77 3.10 0.36 9 2.65 2.97 0.32 102.63 2.94 0.32 11 2.62 2.93 0.32 12 2.57 2.88 0.32 13 2.51 2.81 0.32 142.47 2.77 0.28 15 2.40 2.69 0.28 16 2.38 2.66 0.28 17 2.29 2.57 0.28 182.19 2.45 0.28 19 2.15 2.41 0.28 20 2.04 2.29 0.28 21 1.96 2.19 0.28 221.93 2.16 0.28 23 1.85 2.07 0.28 24 1.76 1.97 0.24 25 1.80 2.02 0.24 261.79 2.01 0.24 27 1.82 2.04 0.24 28 1.85 2.07 0.24 29 1.79 2.01 0.24 301.86 2.08 0.28 31 1.93 2.16 0.28 32 2.08 2.33 0.28 33 2.12 2.37 0.28 342.14 2.40 0.28 35 2.18 2.44 0.28

With the foregoing increased gate length Lg (e.g., 0.36 μm)corresponding to BVdss of the highest VDS FET (e.g., the first FET), anew Lg-distribution can be obtained. An example of such a newLg-distribution is shown in FIG. 10 as a distribution 354, and thecorresponding values are listed in Table 3 under the column indicated as“Scaled Lg.”

It is noted that the example Lg values in FIG. 10 and Table 3 aregrouped in five groups, similar to the example described herein inreference to FIG. 6. It is also noted that the Lg values associated withthe five groups generally follow the trend of the scaled VDS curve 356.Table 4 lists an example scheme that assigns different values fordifferent ranges of the scaled VDS curve 356.

TABLE 4 Range (V) Lg (μm) 3.0 ≦ VDS < 3.5 0.36 2.8 ≦ VDS < 3.0 0.32 2.0≦ VDS < 2.8 0.28 VDS < 2.0 0.24

In some situations, the new Lg distribution obtained in the foregoingexample manner may or may not alter the VDS distribution in a way thatis sub-optimal or undesirable. If such a VDS distribution is sub-optimalor undesirable, one or more steps of the foregoing technique can bemodified.

As described herein, a new Lg distribution obtained in the foregoingmanner can yield a tuned stack of FETs. For example, Lg some values canbe increased (e.g., 0.36 μm which is greater than the constant value of0.32 μm) for FET(s) that need such higher values. On the other hand,some Lg values can be decreased (e.g., 0.24 μm which is less than theconstant value of 0.32 μm) for FET(s) that do not need higher values.Such a tuned configuration can provide a number of performanceimprovements for the stack. Non-limiting examples of such performanceimprovements are described below.

Improved Voltage Handling Capability

As described herein, one or more features of the present disclosure canimprove the voltage handling capability of a stack of FETs. Voltagehandling of a FET is typically specified in terms of a breakdown voltage(BVdss) at which point the leakage current increases and levels ofharmonics increase sharply.

The example tuning configuration described herein in reference to thescaled VDS distribution 356 of FIG. 10 has a total VDS value ofapproximately 90V (sum of the Scaled VDS values for the 35 FETs in Table3), while the un-scaled VDS distribution 352 has a total VDS value ofapproximately 80V. Thus, the tuned configuration is shown to provideapproximately an extra 10V of voltage handling capability for the stack.

The foregoing example improvement in voltage handling capability isdescribed in the context of tuning the gate lengths of the various FETsin the stack. It will be understood that other FET parameters can alsobe tuned to achieve similar results. For example, breakdown voltage(BVdss) optimization or improvement can be achieved by doping profileand/or construction modification. Modification(s) can be made in dopingof the source, drain, body, halo region and/or any other doped area toincrease or decrease the BVdss. In some embodiments, such FET devicescan be fabricated by further processing steps (e.g., extra masks) or useof different construction and/or layout.

In another example, use of thicker gate oxide layers (e.g., 330 in FIG.3) can yield higher breakdown voltage. However, such an increase inBVdss can result in degradation of other parameters such as Ron.Accordingly, tuning of a stack based on the gate oxide layer thicknesscan be achieved by balancing the conflicting performance parameters.

Although the various examples for the voltage handling improvement aredescribed in the context of a stack of FETs, it will be understood thatone or more features of the present disclosure can also be applied toother stacked devices. For example, in the context of a stack havingmicro-electro-mechanical systems (MEMS) devices such as MEMS-capacitorsor MEMS-switches, parameters such as beam length, width, and/orthickness can be tuned to achieve improved voltage handling capability.

Improved Ron Performance:

As described herein, one or more features of the present disclosure canimprove the Ron performance of a stack of FETs. Typically, voltagehandling capability and Ron vary in the same direction. Thus, in someembodiments, if a first FET does not need to withstand as much voltageas a second FET, the first FET can be configured with a Ron that islower than the Ron of the second FET.

In some implementations, a design for a stack of FETs can include afeature of decreasing Ron while maintaining the voltage handlingcapability. For such a design, use of FETs with having desirablecharacteristics for both BVdss and Ron (e.g., lower BVdss and lower Ron)can be utilized. For example, if the initial design uses a 0.32 μm FET,a new FET with Lg<0.32 μm can be utilized if that FET is not subjectedto a higher voltage.

As described herein in the context of the examples associated with FIGS.7-10, Lg can be adjusted to tune the voltage handling capability of eachFET or groups of FETs, thereby yielding a higher voltage handlingcapability for the stack as a whole. In such a design, it is noted thatsome Lg values may be higher than the Lg values in the original design,thereby increasing the Ron values for those FETs. However, because sucha tuned configuration can include some FETs having lower Lg values, thestack overall can have a lower Ron value.

For example, in the Lg values listed in Tables 2 and 3, the sum of fixedLg values in the original design (0.32 μm for each FET in Table 2) isapproximately 11.2 μm. In Table 3, the sum of varying Lg values isapproximately 10.4 μm. Thus, in such particular examples, both of thevoltage handling capability and the Ron performance are improved, withthe former increasing and the latter decreasing. If a design calls foran improved Ron performance with a lowered Ron value for a stack whilemaintaining the overall voltage handling capability, one can see thatthe stack's Ron value can be lowered even further, since the voltagehandling capability does not need to increase.

The foregoing example improvement in Ron performance is described in thecontext of tuning the gate lengths of the various FETs in a stack. Itwill be understood that other FET parameters can also be tuned toachieve similar results. For example, Ron optimization or improvementcan be achieved by doping profile and/or construction modification.Modification(s) can be made in doping of the source, drain, body, haloregion and/or any other doped area to increase or decrease Ron. In someembodiments, such FET devices can be fabricated by further processingsteps (e.g., extra masks) or use of different construction and/orlayout.

In another example, use of thinner gate oxide layers (e.g., 330 in FIG.3) can yield lower Ron values. However, such a decrease in Ron canresult in unwanted degradation of other parameters such as BVdss.Accordingly, tuning of a stack based on the gate oxide layer thicknesscan be achieved by balancing the conflicting performance parameters.

Although the various examples for the Ron performance improvement aredescribed in the context of a stack of FETs, it will be understood thatone or more features of the present disclosure can also be applied toother stacked devices. For example, in the context of a stack havingmicro-electro-mechanical systems (MEMS) devices such as MEMS-capacitorsor MEMS-switches, parameters such as beam length, width, and/orthickness can be tuned to achieve improved Ron performance.

Improved Linearity Performance:

In some implementations, one or more features of the present disclosurecan be utilized to improve linearity performance of a stack of FETs,when the stack is ON and/or when the stack is OFF. When the stack is ON,improvement in linearity performance of the stack can be achieved byreducing the overall Ron of the stack. In some embodiments, such areduction in the overall Ron can be implemented through a use of FETshaving shorter gate lengths as described herein. Other techniquesdescribed herein under the section “Improved Ron Performance” can alsobe utilized to reduce the overall Ron. Such a reduction in the overallRon can reduce the voltage developed across the ON stack, and thusreduce the harmonics or other non-linearity effects generated by thestack.

When the stack is OFF, improvement in linearity performance can beachieved by configuring some of the FETs in the stack to operate nearbreakdown (e.g., by using FETs having higher BVdss), and using higherlinearity FETs that are operated well below their breakdown voltages forsome or all of the other FETs in the stack.

When the stack is ON or OFF, improvement in linearity performance can beachieved by reducing the layout area of the stack. Such a reduction inlayout area can reduce the coupling of the stack with the substrate,thereby reducing non-linearity effects that can be driven by thesubstrate. In some embodiments, such a reduction in layout area can beachieved by, for example, reducing the gate length Lg when appropriateas described herein, and/or reducing the gate width Wg when appropriate,also as described herein.

In some situations, the foregoing example improvement in linearityperformance can be implemented by tuning the gate lengths of the variousFETs in the stack. It will be understood that other FET parameters canalso be tuned to achieve similar results. For example, linearityoptimization or improvement can be achieved by doping profile and/orconstruction modification. Modification(s) can be made in doping of thesource, drain, body, halo region and/or any other doped area to affectlinearity. In some embodiments, such FET devices can be fabricated byfurther processing steps (e.g., extra masks) or use of differentconstruction and/or layout.

In the context of improving linearity performance by reduction in Ron,use of thinner gate oxide layers (e.g., 330 in FIG. 3) can yield lowerRon values. However, such a decrease in Ron can result in unwanteddegradation of other parameters such as BVdss. Accordingly, tuning of astack based on the gate oxide layer thickness can be achieved bybalancing the conflicting performance parameters.

Although the various examples for the linearity performance improvementare described in the context of a stack of FETs, it will be understoodthat one or more features of the present disclosure can also be appliedto other stacked devices. For example, in the context of a stack havingmicro-electro-mechanical systems (MEMS) devices such as MEMS-capacitorsor MEMS-switches, parameters such as beam length, width, and/orthickness can be tuned to achieve improved linearity performance.

Example Method of Configuring a Stack:

FIG. 11 shows a process 360 that can be implemented to configure a stackhaving one or more features as described herein. The process 360 canbegin at block 361; and in block 362, a distribution of a firstparameter associated with FETs of a stack can be obtained. In block 363,the obtained distribution can be adjusted based on the parameterassociated with a selected FET. For example, the first FET in a stackcan have the highest voltage VDS, and the distribution can be adjustedbased on such a VDS value. In block 364, a distribution of a secondparameter can be obtained based on the adjusted distribution. In adecision block 365, the process 360 can determine whether thedistribution of the second parameter is acceptable. If the answer is“Yes,” the process 360 can end in block 366. If the answer is “No,” theprocess 360 can perform steps 363 and 364 to generate anotherdistribution of second parameter.

Example Method of Fabricating a Stack:

FIG. 12 shows a process 370 that can be implemented to fabricate a stackhaving one or more features described herein. In block 371, a substratecan be provided. In some embodiments, such a substrate can be an SOIsubstrate. In block 372, a plurality of FETs can be formed on thesubstrate such that the FETs are arranged in a stack configuration. TheFETs can have a parameter that varies based on a distribution of anotherparameter.

Examples of Switching Applications:

In some embodiments, a FET stack having two or more FETs can beimplemented as an RF switch. FIG. 13 shows an example of an RF switchhaving a stack 210 of a plurality of FETs (e.g., N of such FETs 300 a to300n). Such a switch can be configured as a single-pole-single-throw(SPST) switch. Although described in the context of such an example, itwill be understood that one or more of stacks 210 can be implemented inother switch configurations.

In the example of FIG. 13, each of the FETs (300 a to 300n) can becontrolled by its respective gate bias network 310 and body bias network312. In some implementations, such control operations can be performedin known manners.

In some embodiments, an RF switch such as the example of FIG. 13 caninclude FETs having one or more features described herein. FIG. 14 showsan example RF switch 100 where such features can be implemented asdifferent gate lengths. In the example, an FET stack 210 is shown toinclude FETs (300 a-300 n) with their respective gate lengths (Lg1-Lgn).Some or all of such gate lengths can be selected to be different so asto yield a desirable performance improvement for the RF switch 100.

FIGS. 15-20 show non-limiting examples of switching applications whereone or more features of the present disclosure can be implemented. FIGS.21 and 22 show examples where one or more features of the presentdisclosure can be implemented in SOI devices. FIG. 23-26 show examplesof how one or more features of the present disclosure can be implementedin different products.

Example Components of a Switching Device:

FIG. 15 shows a radio-frequency (RF) switch 100 configured to switch oneor more signals between one or more poles 102 and one or more throws104. In some embodiments, such a switch can be based on one or morefield-effect transistors (FETs) such as silicon-on-insulator (SOI) FETs.When a particular pole is connected to a particular throw, such a pathis commonly referred to as being closed or in an ON state. When a givenpath between a pole and a throw is not connected, such a path iscommonly referred to as being open or in an OFF state.

FIG. 16 shows that in some implementations, the RF switch 100 of FIG. 15can include an RF core 110 and an energy management (EM) core 112. TheRF core 110 can be configured to route RF signals between the first andsecond ports. In the example single-pole-double-throw (SPDT)configuration shown in FIG. 16, such first and second ports can includea pole 102 a and a first throw 104 a, or the pole 102 a and a secondthrow 104 b.

In some embodiments, the EM core 112 can be configured to supply, forexample, voltage control signals to the RF core. The EM core 112 can befurther configured to provide the RF switch 100 with logic decodingand/or power supply conditioning capabilities.

In some embodiments, the RF core 110 can include one or more poles andone or more throws to enable passage of RF signals between one or moreinputs and one or more outputs of the switch 100. For example, the RFcore 110 can include a single-pole double-throw (SPDT or SP2T)configuration as shown in FIG. 16.

In the example SPDT context, FIG. 17 shows a more detailed exampleconfiguration of an RF core 110. The RF core 110 is shown to include asingle pole 102 a coupled to first and second throw nodes 104 a, 104 bvia first and second transistors (e.g., FETs) 120 a, 120 b. The firstthrow node 104 a is shown to be coupled to an RF ground via an FET 122 ato provide shunting capability for the node 104 a. Similarly, the secondthrow node 104 b is shown to be coupled to the RF ground via an FET 122b to provide shunting capability for the node 104 b.

In an example operation, when the RF core 110 is in a state where an RFsignal is being passed between the pole 102 a and the first throw 104 a,the FET 120 a between the pole 102 a and the first throw node 104 a canbe in an ON state, and the FET 120 b between the pole 102 a and thesecond throw node 104 b can be in an OFF state. For the shunt FETs 122a, 122 b, the shunt FET 122 a can be in an OFF state so that the RFsignal is not shunted to ground as it travels from the pole 102 a to thefirst throw node 104 a. The shunt FET 122 b associated with the secondthrow node 104 b can be in an ON state so that any RF signals or noisearriving at the RF core 110 through the second throw node 104 b isshunted to the ground so as to reduce undesirable interference effectsto the pole-to-first-throw operation.

Although the foregoing example is described in the context of asingle-pole-double-throw configuration, it will be understood that theRF core can be configured with other numbers of poles and throws. Forexample, there may be more than one poles, and the number of throws canbe less than or greater than the example number of two.

In the example of FIG. 17, the transistors between the pole 102 a andthe two throw nodes 104 a, 104 b are depicted as single transistors. Insome implementations, such switching functionalities between the pole(s)and the throw(s) can be provided by switch arm segments, where eachswitch arm segment includes a plurality of transistors such as FETs.

An example RF core configuration 130 of an RF core having such switcharm segments is shown in FIG. 18. In the example, the pole 102 a and thefirst throw node 104 a are shown to be coupled via a first switch armsegment 140 a. Similarly, the pole 102 a and the second throw node 104 bare shown to be coupled via a second switch arm segment 140 b. The firstthrow node 104 a is shown to be capable of being shunted to an RF groundvia a first shunt arm segment 142 a. Similarly, the second throw node104 b is shown to be capable of being shunted to the RF ground via asecond shunt arm segment 142 b.

In an example operation, when the RF core 130 is in a state where an RFsignal is being passed between the pole 102 a and the first throw node104 a, all of the FETs in the first switch arm segment 140 a can be inan ON state, and all of the FETs in the second switch arm segment 104 bcan be in an OFF state. The first shunt arm 142 a for the first thrownode 104 a can have all of its FETs in an OFF state so that the RFsignal is not shunted to ground as it travels from the pole 102 a to thefirst throw node 104 a. All of the FETs in the second shunt arm 142 bassociated with the second throw node 104 b can be in an ON state sothat any RF signals or noise arriving at the RF core 130 through thesecond throw node 104 b is shunted to the ground so as to reduceundesirable interference effects to the pole-to-first-throw operation.

Again, although described in the context of an SP2T configuration, itwill be understood that RF cores having other numbers of poles andthrows can also be implemented.

In some implementations, a switch arm segment (e.g., 140 a, 140 b, 142a, 142 b) can include one or more semiconductor transistors such asFETs. In some embodiments, an FET may be capable of being in a firststate or a second state and can include a gate, a drain, a source, and abody (sometimes also referred to as a substrate). In some embodiments,an FET can include a metal-oxide-semiconductor field effect transistor(MOSFET). In some embodiments, one or more FETs can be connected inseries forming a first end and a second end such that an RF signal canbe routed between the first end and the second end when the FETs are ina first state (e.g., ON state).

At least some of the present disclosure relates to how a FET or a groupof FETs can be controlled to provide switching functionalities indesirable manners. FIG. 19 schematically shows that in someimplementations, such controlling of an FET 120 can be facilitated by acircuit 150 configured to bias and/or couple one or more portions of theFET 120. In some embodiments, such a circuit 150 can include one or morecircuits configured to bias and/or couple a gate of the FET 120, biasand/or couple a body of the FET 120, and/or couple a source/drain of theFET 120.

Schematic examples of how such biasing and/or coupling of differentparts of one or more FETs are described in reference to FIG. 20. In FIG.20, a switch arm segment 140 (that can be, for example, one of theexample switch arm segments 140 a, 140 b, 142 a, 142 b of the example ofFIG. 18) between nodes 144, 146 is shown to include a plurality of FETs120. Operations of such FETs can be controlled and/or facilitated by agate bias/coupling circuit 150 a, and a body bias/coupling circuit 150c, and/or a source/drain coupling circuit 150 b.

Gate Bias/Coupling Circuit

In the example shown in FIG. 20, the gate of each of the FETs 120 can beconnected to the gate bias/coupling circuit 150 a to receive a gate biassignal and/or couple the gate to another part of the FET 120 or theswitch arm 140. In some implementations, designs or features of the gatebias/coupling circuit 150 a can improve performance of the switch arm140. Such improvements in performance can include, but are not limitedto, device insertion loss, isolation performance, power handlingcapability and/or switching device linearity.

Body Bias/Coupling Circuit

As shown in FIG. 20, the body of each FET 120 can be connected to thebody bias/coupling circuit 150 c to receive a body bias signal and/orcouple the body to another part of the FET 120 or the switch arm 140. Insome implementations, designs or features of the body bias/couplingcircuit 150 c can improve performance of the switch arm 140. Suchimprovements in performance can include, but are not limited to, deviceinsertion loss, isolation performance, power handling capability and/orswitching device linearity.

Source/Drain Coupling Circuit

As shown in FIG. 20, the source/drain of each FET 120 can be connectedto the coupling circuit 150 b to couple the source/drain to another partof the FET 120 or the switch arm 140. In some implementations, designsor features of the coupling circuit 150 b can improve performance of theswitch arm 140. Such improvements in performance can include, but arenot limited to, device insertion loss, isolation performance, powerhandling capability and/or switching device linearity.

Examples of Switching Performance Parameters: Insertion Loss

A switching device performance parameter can include a measure ofinsertion loss. A switching device insertion loss can be a measure ofthe attenuation of an RF signal that is routed through the RF switchingdevice. For example, the magnitude of an RF signal at an output port ofa switching device can be less than the magnitude of the RF signal at aninput port of the switching device. In some embodiments, a switchingdevice can include device components that introduce parasiticcapacitance, inductance, resistance, or conductance into the device,contributing to increased switching device insertion loss. In someembodiments, a switching device insertion loss can be measured as aratio of the power or voltage of an RF signal at an input port to thepower or voltage of the RF signal at an output port of the switchingdevice. Decreased switching device insertion loss can be desirable toenable improved RF signal transmission.

Isolation

A switching device performance parameter can also include a measure ofisolation. Switching device isolation can be a measure of the RFisolation between an input port and an output port an RF switchingdevice. In some embodiments, it can be a measure of the RF isolation ofa switching device while the switching device is in a state where aninput port and an output port are electrically isolated, for examplewhile the switching device is in an OFF state. Increased switchingdevice isolation can improve RF signal integrity. In certainembodiments, an increase in isolation can improve wireless communicationdevice performance.

Intermodulation Distortion

A switching device performance parameter can further include a measureof intermodulation distortion (IMD) performance. Intermodulationdistortion (IMD) can be a measure of non-linearity in an RF switchingdevice.

IMD can result from two or more signals mixing together and yieldingfrequencies that are not harmonic frequencies. For example, suppose thattwo signals have fundamental frequencies f₁ and f₂ (f₂>f₁) that arerelatively close to each other in frequency space. Mixing of suchsignals can result in peaks in frequency spectrum at frequenciescorresponding to different products of fundamental and harmonicfrequencies of the two signals. For example, a second-orderintermodulation distortion (also referred to as IMD2) is typicallyconsidered to include frequencies f₁+f₂ f₂−f₁, 2_(f) ₁, and 2f₂. Athird-order IMD (also referred to as IMD3) is typically considered toinclude 2f₁+f₂, 2f₁−f₂, f₁+2f₂, f₁−2f₂. Higher order products can beformed in similar manners.

In general, as the IMD order number increases, power levels decrease.Accordingly, second and third orders can be undesirable effects that areof particular interest. Higher orders such as fourth and fifth orderscan also be of interest in some situations.

In some RF applications, it can be desirable to reduce susceptibility tointerference within an RF system. Non linearity in RF systems can resultin introduction of spurious signals into the system. Spurious signals inthe RF system can result in interference within the system and degradethe information transmitted by RF signals. An RF system having increasednon-linearity can demonstrate increased susceptibility to interference.Non-linearity in system components, for example switching devices, cancontribute to the introduction of spurious signals into the RF system,thereby contributing to degradation of overall RF system linearity andIMD performance.

In some embodiments, RF switching devices can be implemented as part ofan RF system including a wireless communication system. IMD performanceof the system can be improved by increasing linearity of systemcomponents, such as linearity of an RF switching device. In someembodiments, a wireless communication system can operate in a multi-bandand/or multi-mode environment. Improvement in intermodulation distortion(IMD) performance can be desirable in wireless communication systemsoperating in a multi-band and/or multi-mode environment. In someembodiments, improvement of a switching device IMD performance canimprove the IMD performance of a wireless communication system operatingin a multi-mode and/or multi-band environment.

Improved switching device IMD performance can be desirable for wirelesscommunication devices operating in various wireless communicationstandards, for example for wireless communication devices operating inthe LTE communication standard. In some RF applications, it can bedesirable to improve linearity of switching devices operating inwireless communication devices that enable simultaneous transmission ofdata and voice communication. For example, improved IMD performance inswitching devices can be desirable for wireless communication devicesoperating in the LTE communication standard and performing simultaneoustransmission of voice and data communication (e.g., SVLTE).

High Power Handling Capability

In some RF applications, it can be desirable for RF switching devices tooperate under high power while reducing degradation of other deviceperformance parameters. In some embodiments, it can be desirable for RFswitching devices to operate under high power with improvedintermodulation distortion, insertion loss, and/or isolationperformance.

In some embodiments, an increased number of transistors can beimplemented in a switch arm segment of a switching device to enableimproved power handling capability of the switching device. For example,a switch arm segment can include an increased number of FETs connectedin series, an increased FET stack height, to enable improved deviceperformance under high power. However, in some embodiments, increasedFET stack height can degrade the switching device insertion lossperformance.

Examples of FET Structures and Fabrication Process Technologies:

A switching device can be implemented on-die, off-die, or somecombination thereof. A switching device can also be fabricated usingvarious technologies. In some embodiments, RF switching devices can befabricated with silicon or silicon-on-insulator (SOI) technology.

As described herein, an RF switching device can be implemented usingsilicon-on-insulator (SOI) technology. In some embodiments, SOItechnology can include a semiconductor substrate having an embeddedlayer of electrically insulating material, such as a buried oxide layerbeneath a silicon device layer. For example, an SOI substrate caninclude an oxide layer embedded below a silicon layer. Other insulatingmaterials known in the art can also be used.

Implementation of RF applications, such as an RF switching device, usingSOI technology can improve switching device performance. In someembodiments, SOI technology can enable reduced power consumption.Reduced power consumption can be desirable in RF applications, includingthose associated with wireless communication devices. SOI technology canenable reduced power consumption of device circuitry due to decreasedparasitic capacitance of transistors and interconnect metallization to asilicon substrate. Presence of a buried oxide layer can also reducejunction capacitance or use of high resistivity substrate, enablingreduced substrate related RF losses. Electrically isolated SOItransistors can facilitate stacking, contributing to decreased chipsize.

In some SOI FET configurations, each transistor can be configured as afinger-based device where the source and drain are rectangular shaped(in a plan view) and a gate structure extends between the source anddrain like a rectangular shaped finger. FIGS. 21A and 21B show plan andside sectional views of an example finger-based FET device implementedon SOI. As shown, FET devices described herein can include a p-type FETor an n-type FET. Thus, although some FET devices are described hereinas p-type devices, it will be understood that various conceptsassociated with such p-type devices can also apply to n-type devices.

As shown in FIGS. 21A and 21B, a pMOSFET can include an insulator layerformed on a semiconductor substrate. The insulator layer can be formedfrom materials such as silicon dioxide or sapphire. An n-well is shownto be formed in the insulator such that the exposed surface generallydefines a rectangular region. Source (S) and drain (D) are shown to bep-doped regions whose exposed surfaces generally define rectangles. Asshown, S/D regions can be configured so that source and drainfunctionalities are reversed.

FIGS. 21A and 21B further show that a gate (G) can be formed on then-well so as to be positioned between the source and the drain. Theexample gate is depicted as having a rectangular shape that extendsalong with the source and the drain. Also shown is an n-type bodycontact. Formations of the rectangular shaped well, source and drainregions, and the body contact can be achieved by a number of knowntechniques.

FIGS. 22A and 22B show plan and side sectional views of an example of amultiple-finger FET device implemented on SOI. Formations of rectangularshaped n-well, rectangular shaped p-doped regions, rectangular shapedgates, and n-type body contact can be achieved in manners similar tothose described in reference to FIGS. 21A and 21B.

The example multiple-finger FET device of FIGS. 22A and 22B can beconfigured so that the source regions are electrically connectedtogether to a source node, and the drain regions are connected togetherto a drain node. The gates can also be connected together to a gatenode. In such an example configuration, a common gate bias signal can beprovided through the gate node to control flow of current between thesource node and the drain node.

In some implementations, a plurality of the foregoing multi-finger FETdevices can be connected in series as a switch to allow handling of highpower RF signals. Each FET device can divide the overall voltage dropassociated with power dissipation at the connected FETs. A number ofsuch multi-finger FET devices can be selected based on, for example,power handling requirement of the switch.

Examples of Implementations in Products:

Various examples of FET-based switch circuits described herein can beimplemented in a number of different ways and at different productlevels. Some of such product implementations are described by way ofexamples.

Semiconductor Die Implementation

FIGS. 23A-23D show non-limiting examples of such implementations on oneor more semiconductor die. FIG. 23A shows that in some embodiments, aswitch circuit 120 and a bias/coupling circuit 150 having one or morefeatures as described herein can be implemented on a die 800. FIG. 23Bshows that in some embodiments, at least some of the bias/couplingcircuit 150 can be implemented outside of the die 800 of FIG. 23A.

FIG. 23C shows that in some embodiments, a switch circuit 120 having oneor more features as described herein can be implemented on a first die800 a, and a bias/coupling circuit 150 having one or more features asdescribed herein can be implemented on a second die 800 b. FIG. 23Dshows that in some embodiments, at least some of the bias/couplingcircuit 150 can be implemented outside of the first die 800 a of FIG.23C.

Packaged Module Implementation

In some embodiments, one or more die having one or more featuresdescribed herein can be implemented in a packaged module. An example ofsuch a module is shown in FIGS. 24A (plan view) and 24B (side view).Although described in the context of both of the switch circuit and thebias/coupling circuit being on the same die (e.g., example configurationof FIG. 23A), it will be understood that packaged modules can be basedon other configurations.

A module 810 is shown to include a packaging substrate 812. Such apackaging substrate can be configured to receive a plurality ofcomponents, and can include, for example, a laminate substrate. Thecomponents mounted on the packaging substrate 812 can include one ormore dies. In the example shown, a die 800 having a switching circuit120 and a bias/coupling circuit 150 is shown to be mounted on thepackaging substrate 812. The die 800 can be electrically connected toother parts of the module (and with each other where more than one dieis utilized) through connections such as connection-wirebonds 816. Suchconnection-wirebonds can be formed between contact pads 818 formed onthe die 800 and contact pads 814 formed on the packaging substrate 812.In some embodiments, one or more surface mounted devices (SMDs) 822 canbe mounted on the packaging substrate 812 to facilitate variousfunctionalities of the module 810.

In some embodiments, the packaging substrate 812 can include electricalconnection paths for interconnecting the various components with eachother and/or with contact pads for external connections. For example, aconnection path 832 is depicted as interconnecting the example SMD 822and the die 800. In another example, a connection path 832 is depictedas interconnecting the SMD 822 with an external-connection contact pad834. In yet another example a connection path 832 is depicted asinterconnecting the die 800 with ground-connection contact pads 836.

In some embodiments, a space above the packaging substrate 812 and thevarious components mounted thereon can be filled with an overmoldstructure 830. Such an overmold structure can provide a number ofdesirable functionalities, including protection for the components andwirebonds from external elements, and easier handling of the packagedmodule 810.

FIG. 25 shows a schematic diagram of an example switching configurationthat can be implemented in the module 810 described in reference toFIGS. 24A and 24B. In the example, the switch circuit 120 is depicted asbeing an SP9T switch, with the pole being connectable to an antenna andthe throws being connectable to various Rx and Tx paths. Such aconfiguration can facilitate, for example, multi-mode multi-bandoperations in wireless devices.

The module 810 can further include an interface for receiving power(e.g., supply voltage VDD) and control signals to facilitate operationof the switch circuit 120 and/or the bias/coupling circuit 150. In someimplementations, supply voltage and control signals can be applied tothe switch circuit 120 via the bias/coupling circuit 150.

Wireless Device Implementation

In some implementations, a device and/or a circuit having one or morefeatures described herein can be included in an RF device such as awireless device. Such a device and/or a circuit can be implementeddirectly in the wireless device, in a modular form as described herein,or in some combination thereof. In some embodiments, such a wirelessdevice can include, for example, a cellular phone, a smart-phone, ahand-held wireless device with or without phone functionality, awireless tablet, etc.

FIG. 26 schematically depicts an example wireless device 900 having oneor more advantageous features described herein. In the context ofvarious switches and various biasing/coupling configurations asdescribed herein, a switch 120 and a bias/coupling circuit 150 can bepart of a module 810. In some embodiments, such a switch module canfacilitate, for example, multi-band multi-mode operation of the wirelessdevice 900.

In the example wireless device 900, a power amplifier (PA) module 916having a plurality of PAs can provide an amplified RF signal to theswitch 120 (via a duplexer 920), and the switch 120 can route theamplified RF signal to an antenna. The PA module 916 can receive anunamplified RF signal from a transceiver 914 that can be configured andoperated in known manners. The transceiver can also be configured toprocess received signals. The transceiver 914 is shown to interact witha baseband sub-system 910 that is configured to provide conversionbetween data and/or voice signals suitable for a user and RF signalssuitable for the transceiver 914. The transceiver 914 is also shown tobe connected to a power management component 906 that is configured tomanage power for the operation of the wireless device 900. Such a powermanagement component can also control operations of the basebandsub-system 910 and the module 810.

The baseband sub-system 910 is shown to be connected to a user interface902 to facilitate various input and output of voice and/or data providedto and received from the user. The baseband sub-system 910 can also beconnected to a memory 904 that is configured to store data and/orinstructions to facilitate the operation of the wireless device, and/orto provide storage of information for the user.

In some embodiments, the duplexer 920 can allow transmit and receiveoperations to be performed simultaneously using a common antenna (e.g.,924). In FIG. 26, received signals are shown to be routed to “Rx” paths(not shown) that can include, for example, a low-noise amplifier (LNA).

A number of other wireless device configurations can utilize one or morefeatures described herein. For example, a wireless device does not needto be a multi-band device. In another example, a wireless device caninclude additional antennas such as diversity antenna, and additionalconnectivity features such as Wi-Fi, Bluetooth, and GPS.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Detailed Description using thesingular or plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While some embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. A switching device comprising: a first terminaland a second terminal; and a plurality of switching elements connectedin series to form a stack between the first terminal and the secondterminal, the switching elements having a non-uniform distribution of aparameter, the non-uniform distribution resulting in the stack having afirst voltage handling capacity that is greater than a second voltagehandling capacity corresponding to a similar stack having asubstantially uniform distribution of the parameter.
 2. The switchingdevice of claim 1 wherein the stack further has a first ON-resistance(Ron) value that is less than a second Ron value corresponding to thesimilar stack.
 3. The switching device of claim 1 wherein the stackfurther has a first linearity performance that is better than a secondlinearity performance corresponding to the similar stack.
 4. Theswitching device of claim 1 wherein each of the plurality of switchingelements includes a field-effect transistor (FET) having a source, adrain and a gate formed on the active region.
 5. The switching device ofclaim 4 wherein the FET is implemented as a silicon-on-insulator (SOI)device.
 6. The switching device of claim 4 wherein the parameterincludes a length of the gate.
 7. The switching device of claim 6wherein the FET is implemented as a finger configuration device suchthat the gate includes a number of rectangular shaped gate fingers, eachgate finger implemented between a rectangular shaped source finger ofthe source contact and a rectangular shaped drain finger of the draincontact.
 8. The switching device of claim 6 wherein the non-uniformdistribution of the gate length is based on a non-uniform distributionof another parameter associated with the FETs.
 9. The switching deviceof claim 8 wherein the other parameter includes a distribution ofvoltage VDS across each FET.
 10. The switching device of claim 9 whereinthe non-uniform distribution of the gate length is selected to yield ascaled version of the voltage VDS distribution.
 11. The switching deviceof claim 10 wherein the scaled version of the voltage VDS distributionis based on scaling of the highest value of a voltage VDS distributioncorresponding to a substantially uniform distribution of the gatelength.
 12. The switching device of claim 11 wherein the highest valueof the voltage VDS is for the first FET from the first terminal.
 13. Theswitching device of claim 12 wherein the first terminal is configured asan input terminal for receiving a radio-frequency (RF) signal.
 14. Theswitching device of claim 12 wherein the gate length of at least thefirst FET is greater than the value of the uniform distribution of thegate length.
 15. The switching device of claim 14 wherein at least someof the FETs have gate lengths that are less than the value of theuniform distribution of the gate length.
 16. The switching device ofclaim 12 wherein the sum of the VDS values of the FETs for thenon-uniform distribution of the gate length is greater than the sum ofthe VDS values of the FETs for the uniform distribution of the gatelength.
 17. The switching device of claim 16 wherein the sum of the gatelengths of the FETs for the non-uniform distribution of the gate lengthis greater than the sum of the gate length of the FETs for the uniformdistribution of the gate length.
 18. The switching device of claim 8wherein the non-uniform distribution of the gate length includes aplurality of groups of gate length values, each group having a commonvalue of the gate length.
 19. A method for fabricating a radio-frequency(RF) switching device, the method comprising: providing a semiconductorsubstrate; forming a plurality of field-effect transistors (FETs) on thesemiconductor substrate such that the FETs have a non-uniformdistribution of a parameter; and connecting the FETs to form a stack,such that the non-uniform distribution results in the stack having afirst voltage handling capacity that is greater than a second voltagehandling capacity corresponding to a similar stack having asubstantially uniform distribution of the parameter.
 20. Aradio-frequency (RF) switching module comprising: a packaging substrateconfigured to receive a plurality of components; and a die mounted onthe packaging substrate, the die having a switching circuit thatincludes a plurality of field-effect transistors (FETs) connected inseries to form a stack, the FETs having a non-uniform distribution of aparameter, the non-uniform distribution resulting in the stack having afirst voltage handling capacity that is greater than a second voltagehandling capacity corresponding to a similar stack having asubstantially uniform distribution of the parameter.